BGA rework equipment×ケイ・オール - メーカー・企業と製品の一覧

BGA rework with underfill

Advanced rework technology! It prevents the concentration of stress that occurs on the connection surface of solder balls.

BGA is mounted on the printed circuit board by solder balls. Due to weak connection strength, there may be cases where the reliability of the connection cannot be maintained due to the detachment of the BGA or the occurrence of cracks at the solder joints in response to external stresses such as impact or bending. To address such issues and improve connection reliability, a sealing resin called underfill is used in the gap between the component and the board. 【Features】 ■ Uses a one-component heat-curing epoxy resin ■ Can reduce external stresses ■ Prevents concentration of stress at the connection surfaces of the solder balls ■ Widely used in mobile devices such as mobile phones and music players *For more details, please refer to the PDF document or feel free to contact us.

企業：ケイ・オール
価格：Other

Contract manufacturing

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

Technical Document "Underfill BGA Rework Technology"

Can also cooperate in criminal investigations!

We can collaborate using underfill BGA rework technology. We can handle everything from the removal of underfill and coated components (such as BGA and CSP) to reballing, replacement, and reinstallation. The cured underfill material seals the BGA, significantly improving its strength compared to standard BGAs, and while its effectiveness is tremendous, the rework tasks such as removal or component replacement are more challenging than typical rework processes. At K-All, we have worked on methods and technical research to ensure that rework can be performed even on devices with various underfill materials applied. We can handle everything from component removal to reballing and replacement reinstallation. Rework and reballing are also possible for BGAs and CSPs that have undergone underfill and coating treatment. We can replace solder balls on BGAs and CSPs from lead-free to eutectic. We maintain over 5,000 types of masks for rework. ● For more details, please download the catalog or contact us.

企業：ケイ・オール
価格：Other

others

ブックマークに追加いたしました

ブックマーク一覧

ブックマークを削除いたしました

ブックマーク一覧

これ以上ブックマークできません

会員登録すると、ブックマークできる件数が増えて、ラベルをつけて整理することもできます

無料会員登録

[Exchange/Installation/Removal] High-quality BGA rework

BGA exchange, installation, and removal services available! We have received voices of joy.

"BGA rework" refers to the process of partially heating BGA devices on completed circuit boards using specialized rework machines, tailored to specific needs. At K-All, we can handle both eutectic and lead-free soldering, and we have received positive feedback from many customers. We can perform work tailored to customer requests and the condition and symptoms of the circuit board. 【Features】 ■ Stable cleaning operations for circuit boards and removed devices ■ Cream solder supply (printing and coating) technology ■ Support for 0402 chips and micro-sized packages ■ Compatibility with large and multilayer circuit boards ■ Ability to accommodate a wide range of pitches, including special pitches *For more details, please refer to the PDF materials or feel free to contact us.